At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. What your background should look like:

Responsibilities:
•    Establishing signal integrity design performance/functional requirements for new products.
•    Working with layout function team on PCB design schematic, layout and fab drawing reviews.
•    Creating actionable recommendations based upon design reviews and simulation results.
•    Guiding cable assembly design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement.
•    Define SI requirement and test/validation plan, SI data post processing, report preparation. 
•    Leading resolve SI/electrical issues down to the closure. 
•    Support customer on concept design and spec discussion, recommendation, study customer specification.
•    Other tasks assigned by the manager.

 

What your background should look like:
Required Skills/Experience:
•    Bachelor’s degree in Electronics, Telecommunication, Microwave engineering or related, Master’s degree is a plus.
•    Minimum of 5 years of work experience in a signal integrity engineering role.
•    Experience with interconnect design or experience with cable assembly &/or connector design (high speed twinax cables, direct attach copper (DAC) cables), &/or RF antenna, RF sub-system.
•    PCB design tools (Altium designer, Allegro, etc.), Signal integrity tools (Ansys HFSS, PLTS, SnpExpert, etc.).
•    Familiar with printed circuit board design, fabrication, and assembly, familiar with PCB material characteristic. Proficient in Altium a PLUS.
•    Familiar with highspeed cable assembly critical process (stripping, termination, melting, etc.) impact on SI result.
•    Familiar with Industrial spec like PCI-Sig, IEEE, SAS, etc. 
•    Familiar with FRU/EEPROM programming is preferrable.
•    Experience in project leadership, especially as it applies across design, development & manufacturing teams.
•    Familiar with VNA and calibration & de-embedding skill
•    Good verbal and written communication skills.

Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork