深圳(Shenzhen), Guangdong, China
18 days ago
数字后端设计工程师
General Information Req # 100014804 Career area: Engineering Country/Region: China State: Guangdong City: 深圳(Shenzhen) Date: Thursday, July 27, 2023 Additional Locations:  * China Why Work at Lenovo We are Lenovo. We do what we say. We own what we do. We WOW our customers. 
Lenovo is a US$57 billion revenue global technology powerhouse, ranked #248 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY). 
This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub. Description and Requirements

岗位职责:

1,ASIC IC芯片后端设计从RTL到GDSII;

2,具备完整的芯片Tapeout经验,后端布局规划(模块级或全芯片级);

3,熟悉STA静态时序分析及低功耗设计与分析;

4,物理验证能力LVS/DRC/ERC/LVL/RTO/ANT/LUP;

5,布局布线,电源网络设计,时序收敛,功耗分析,物理验证等,掌握其中一或多个技能。

任职要求:

1. 电子工程本科及以上学历,1-3年物理设计实现相关工作经验;

2. 熟练使用主流数字后端设计平台工具,具有TCL/Perl等脚本编程经验;

3. 具备以下单项或多项经验:从RTL到GDS的芯片、复杂模块级设计实现,芯片级测试,ASIC设计和仿真,ASIC物理版图,集成电路制造和工艺;

4. 能够帮助和带领初级工程师解决问题;


Additional Locations:  * China * China
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