Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advance Packaging Technology Development Engineer (ATPDE)

JOB DESCRIPTION: 

Micron’s Assembly Package Development Team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron’s memory products from pathfinding through NPI start up including side by side certification with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working closely with Design teams (Globally) and you will be involved in the design approvals (substrate and silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An importance of this role is pathfinding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed.  Other responsibilities may include conducting supplier interactions/meetings and drive NDAs for new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

JOB REQUIREMENT

·        Experience: More than 5 years experience in semiconductor manufacturing or a related field, with hands-on experience in Semiconductor Packaging or Fab Frontend processes. Experience with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.

·        Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. PhD / Masters Degree is preferred

·        Technical Experience: Development experience in one or more areas of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond

·        Problem-Solving Abilities: Strong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parameters

·        Communication Skills: Fluent in English. Effective verbal and written communication skills, with the ability to communicate clearly and professionally with global team members and stakeholders

·        Adaptability: Ability to work effectively in a fast-paced and dynamic environment, with the flexibility to work with global teams across different time zones

·        Team Player: Collaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals.

·        Travel: up to 25% travel if needed

"The specified role does not encompass the following responsibilities: Finalization of sales agreements or the execution of sales contracts is prohibited. The role also does not carry the authority to make definitive decisions regarding contracts, be it their conclusion or termination. Furthermore, the role is not designed to involve participation in pricing negotiations or the authorization of contracts. These activities fall beyond the permissible duties of the position."

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_na@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.