The application window is expected to close on:  12/09/2024.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Meet the Team

Cisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. Your Impact Cisco SiliconOne ASIC team is looking for an advanced IC package designer to help us develop our next generation silicon and platforms. You will work on cutting-edge FCBGA substrates that push the boundaries on power, speed, and fabrication / assembly technology. You will drive package planning & layout to enable on-time, high-quality manufacturing releases. You will be a proficient learner, you will actively implement new technologies and rules, and you will excel in documenting and communicating critical information to the team.

Collaborate with ASIC and Physical Design teams to evaluate and develop floorplans that result in optimal substrate integrationWork with multi-disciplinary teams (system, thermal, mechanical, connector) to understand needs and to create guidance for package implementationPlan substrate designs, including stackups, materials, and design rules, optimized to meet stringent Signal Integrity and Power Integrity rulesImplement package routing with fabrication/assembly aware approachDesign and build power connectivity structures for high power applicationsDrive designs towards successful, on-time completion while meeting important milestonesContribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammatesNegotiate with external manufacturing partners to specify and build best-in-class packages that meet stringent performance and test criteria Minimum Qualifications:
Degree in Electrical Engineering or related field, or equivalent experience4+ years in the industry with IC Package or PCB developmentFluent in Cadence Allegro Package DesignerStrong communication and documentation skillsPreferred Qualifications:
Fluent in Orbit IOFluent in Calibre for DRC verificationExperience with 2.5D package design, including wafer level fan-outExperience with very large pin count packages or equivalent PCBsFamiliarity with AutoCADWorking knowledge of Signal and Power Integrity fundamentals #WeAreCisco
#WeAreCisco where every individual brings their unique skills and perspectives together to pursue our purpose of powering an inclusive future for all. Our passion is connection—we celebrate our employees’ diverse set of backgrounds and focus on unlocking potential. Cisconians often experience one company, many careers where learning and development are encouraged and supported at every stage. Our technology, tools, and culture pioneered hybrid work trends, allowing all to not only give their best, but be their best. We understand our outstanding opportunity to bring communities together and at the heart of that is our people. One-third of Cisconians collaborate in our 30 employee resource organizations, called Inclusive Communities, to connect, foster belonging, learn to be informed allies, and make a difference. Dedicated paid time off to volunteer—80 hours each year—allows us to give back to causes we are passionate about, and nearly 86% do! Our purpose, driven by our people, is what makes us the worldwide leader in technology that powers the internet. Helping our customers reimagine their applications, secure their enterprise, transform their infrastructure, and meet their sustainability goals is what we do best. We ensure that every step we take is a step towards a more inclusive future for all. Take your next step and be you, with us!