Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsibilities will include, but are not limited to:
Author the Establish Project Program (EPP) documents for 2.5D/3D, Flip Chip and Stacked Die Wirebonded Packages. Drive technology integration activities for the test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.Coordinate core team in Development and NPI space of advanced packages to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.Interface closely with cross functional teams that include Product Development, wafer level process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.Support and collaborate with customers to ensure that Micron’s products can meet their quality, reliability, system, and operational needs.Successful candidates for this position will have:
Appreciation for Structured Problem Solving.Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results.Excellent interpersonal skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.Experience and solid understanding with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus.Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle is a plus.Strong publication record, patents, or contributions to industry standards are highly desirable.Proven leadership experience in guiding cross-functional teams and driving technical perfection.Required Experience:
Bachelor/Master of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred.8+ years of relevant experienceAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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