ASIC Package Signal/Power Integrity Engineer
Cisco
The application window is expected to close on: 01/05/2025.
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.
Meet the Team
Cisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies.
Your Impact
Cisco SiliconOne ASIC team is looking for an expert in Signal and Power Integrity to help us develop our next generation ASIC packaging. You will work on cutting-edge FCBGA substrates that push the boundaries on power, speed, and fabrication / assembly technology. You will drive ASIC package power and signal integrity rules and layout analysis to enable on-time, high-quality manufacturing releases. You will actively implement the latest SERDES speeds and technologies while developing creative solutions for these signaling and power distribution challenges.
* Develop design rules for ultra-high speed signaling
* Analyze substrate SI/PI and provide feedback for layout
* Collaborate with the layout team to develop the best overall solution
* Collaborate with system partners to achieve the best combined power and signal integrity across the interposer, substate, and PCB.
* Document design rules and post layout extraction results
Minimum Qualifications:
* Bachelor’s degree in electrical engineering or related field
* 7+ years of experience in Signal and/or Power Integrity
* Strong background in Electromagnetics
* Good understanding of scattering and impedance network parameters
* Proficient in Ansys EM flow
* Proficient with Cadence APD for layout review
* Fluent in Keysight ADS
* Working knowledge of SPICE
Preferred Qualifications:
* Master’s degree in electrical engineering or related field
* Experience with MATLAB or Python scripting
* Experience with SI/PI of 2.5D advanced ASIC packaging
* Experience with Raptor-X
* Working knowledge of Vector Network Analysis
* Basic knowledge of IBIS
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