Summary:

Operation of automatic and/or manual wire bond equipment in a clean-room environment, to manufacture high-reliability microelectronic devices.

 

Essential Duties and Responsibilities:

Read and interpret assembly instructions, drawings and work instruction processes. Set up and run automatic and manual wire bond equipment Ability to handle computers in order to fine tune machine programs. Written tests for ESD + wirebond and ribbon bond requirements. Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales. Knowledge of periodic machines certification for bond strengths. Inspect and know the difference between an acceptable epoxy placement, die attach assembly, sub attached assembly and wire bond and ribbon bonds on a microelectronic device, in conformance with work instructions, drawings and specifications. Inspect - to the drawings/specs and procedures – the devices for defects before starting the assembly and after finishing his/her part of the assembly. Adhere to all ESD and other handling requirements. Comply with all in-house training as identified in job specific family and or specific training plan. Follow company 6S and continuous improvement (kaizen) objectives. Perform all other duties, as assigned.