Position: Bell Labs Thermal Research Intern
Number of Position(s): 1
Duration: 10 Weeks
Date: June 2nd to Aug 8th, 2025
Location: Onsite, Murray Hill, NJ.

The team you'll be part of:

This team performs cutting-edge research in the field of thermal management of next-generation telecommunications and computing systems across multiple scales (device-, board- and rack-levels). Research activities include thermal management solutions for data centers, hybrid cooling for highly integrated telecommunications equipment, passive heat spreaders, thermal management solutions, and temperature control for optoelectronics, and many others. 

 

Educational Recommendations 

Currently a candidate for a PhD in Mechanical Engineering , or a related field with an accredited school in the US.  

Knowledge of thermodynamics, heat, and mass transfer, and two-phase flow Experience with measurement techniques (e.g. temperature, pressure, flow rate, infrared thermography, etc.), calibrations, and data processing   Experience with Matlab, Python, SolidWorks, LabView, COMSOL Problem-solving mind, creative and good communication skills

As part of our team, you will:

Participate in a broad range of aspects from conception to development, including design, simulations / modeling, fabrication, testing and implementation of novel thermal management technologies. 

The student would be encouraged to present research findings through oral presentations within the company, as well as generate publications for the leading conferences and journals in the field of thermal sciences.