Summary: Seeking a Die Attach Operator on 3rd shift with experience in microelectronics module assembly and Mil Std 883.

Job Requirements:

Minimum of 2 years experience in microelectronics module assembly

HS diploma required

Ability to set-up, operate, and adjust or learn to run a variety of microelectronic production equipment

Knowledge of wire-bonding gold wire or ribbon to various die and substrates

Experience with die attach using solder preforms or epoxy

Preferred Skills:

Experience working in a cleanroom environment following ESD protocols

Job Responsibilities:

Work under direction from production schedules, manufacturing procedures, process plans, and instructions

Operate and set-up manual gold wire bonders and manual eutectic/epoxy die attach systems per micro-circuit layout drawing

Ensure proper wire formation, bond appearance, and bond strength per Mil Std 883

Ensure proper die attachment including coverage and die shear strength per Mil Std 883

Train in multiple Microelectronics processes involving other assembly activities

Maintain compliance with Mil Standard 883 requirements through detailed production activities and documentation