Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR54457 GQ (Global Quality) Package Reliability EngineerJob Description
As a GQ (Global Quality) Package Reliability Engineer in the Product Quality and Reliability Assurance team at Micron Technology Inc., the main responsibility is package quality and reliability for one of Micron’s product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced; and providing recommendations on product release based on package reliability test results. You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers), and prepare reports for discussion with partners. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.
Responsibilities and Tasks:
Lead Regulation for New Product Qualifications
Coordinating package qualification efforts for new products and when new designs, materials, or processes are introducedProvide comprehensive qualification plans for new developmentsProvide recommendations on product release based on package reliability test results
Design and Implement Reliability Test Plans
Regulate Root Cause and Corrective Action Plans
Act as a liaison for both Internal and External Customers
Education: Bachelor’s Degree or equivalent experience
Engineering – ElectronicsEngineering - Materials ScienceEngineering – MechanicalRelated field of studyQualification :
Detailed knowledge of semiconductor component package assembly processes and challengesKnowledge of surface mount processes and challengesUnderstanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assembliesGood understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliabilityGood understanding of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferredMust be self-motivated, able to work independently, and detail orientedStrong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groupsGood written and verbal communication skills in English and digital literacy are vitalAbility for other Asian languages, especially Chinese and Japanese, can be a plusGood understanding of the software systems employed in backend manufacturingUnderstanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
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