Entity: Oracle America, Inc.

 

Job Duties:

Evaluate reliability of materials, properties and techniques used in production; plan, design and develop electronic parts, components, integrated circuitry, mechanical systems, equipment and packaging, optical systems and/or DSP systems. Responsible for designing, developing, modifying and evaluating electronic, electromechanical or mechanical components, assemblies or integrated circuitry for hardware systems for the external market. Includes new design, as well as modification activities that results in significant product enhancement. Activities encompass design, analysis, testing and process development using engineering principles and methods. Technical disciplines may include electrical and logical design of printed circuits; mechanical design or electronics enclosures or integrated circuit packaging; and embedded software/firmware design. May telecommute. (385.33416)

Employer will accept a Master’s degree in Computer Science, Engineering, or related technical field and two years of experience in job offered or in a hardware developer-related occupation.

Position requires:

Use of different-sized wind tunnels to measure server/component-level airflow and pressure impedance; Build high-accuracy thermal models using commercial CFD software including Flow Simulation, Flotherm, and Icepak; Write and modify shell scripts and Python codes to automate thermal tests and post-process large data sets; Conduct thermal qualification tests using thermal chambers and using software and applications including PTU, NVQual, FIO, and to stress different server components including CPU, GPU, Drives, and DIMMs; Set up fans in wind tunnels to measure fan performance curves at different PWMs and setting up thermal test vehicles to measure heatsink performance at different power and airflow; Fan Speed Control algorithm defining key parameters in Proportional,  Integral, and Derivative control to meet thermal targets and optimize performance; CAD tools including Solid Works and Creo to design extruded, skived, stamped, forged, vapor chamber, or heat pipe heatsink solutions by taking into consideration manufacturability and volume of production; and Instrument different pressure, temperature, and acoustic sensors, and set up LabVIEW and Agilent data acquisition systems to measure server thermal performance.

Career Level - IC3