**Introduction** We are part of a world-class product development organization that pioneers industry-leading hardware designs for IBM Z and POWER System servers, as well as Storage, Quantum, and IBM Research. Within this organization, the IBM thermal and mechanical design team is seeking a professional with experience in mechanical modeling with hands-on experience in building, testing and validating hardware. The candidate will join an industry-leading multi-disciplinary team of engineers, pioneering high-performance and high-reliability server solutions. The role involves designing and optimizing IBM module and server hardware systems to meet the thermal and mechanical requirements. The candidate will collaborate with multi-functional teams to ensure designs meet performance, structural integrity, safety, and manufacturability standards. Primary responsibilities include developing detailed models, running simulations, building, characterizing and testing systems and providing insights to guide the design and engineering process. **Your role and responsibilities** As a core member of the team, you will be expected to work autonomously and deliver on project phases on-time and on-budget, and support chip design, micro-electronic packaging and system-level teams with modeling, simulation, material testing, hardware characterization and reporting. Specific duties include: · Utilize state of the art CAD and FEA (Finite-Element Analysis) tools to create and simulate models of system-level test and product hardware. · Generate lab data and/or collaborate with teams to obtain material properties that are needed to create such models to ensure accuracy in modeling prediction. · Collect and analyze qualification test data by collaborating with team members and technicians. Validate the data with modeling results. · Create detailed reports and presentations to inform development teams, project management, line management and executives. · Provide guidelines to various design teams for reliable hardware designs which includes but is not limited to the following components: Laminates, TIM (thermal interface material), cold plate/cooler/lid, chip(s), GPU(s), HBM(s) and load actuation hardware. · Influence design decisions to ensure effective solutions for IBM’s server mainframes **Required technical and professional expertise** Masters/PhD in Mechanical Engineering · 3+ years of experience in Finite-Element Modeling (FEM) · Proficiency in CAD tools and 3D modeling (SolidWorks preferred) · Proficiency in FEM tools such as ANSYS or Celsius · Skilled in design for manufacturability (DFM) · Hands-on experience with lab tools · Strong verbal and written communication skills, problem-solving, and time management · Self-motivated and capable of independently driving tasks to completion · Must be effective working in a multi-functional team-based atmosphere **Preferred technical and professional experience** 5+ years of experience in Mechanical modeling · Experience in performing static structural FEA models and predicting stresses/strains/warpage etc. · Experience in performing moisture diffusion and swelling simulations · Knowledge of server and computer architecture · Hands-on experience with lab tools such as Universal tensile tester (Instron/MTS), Dynamic Mechanical Analyzer (DMA), Thermal Mechanical Analyzer (TMA) and Thermo-Gravimetric Analyzer (TGA). · Good knowledge of applied statistics and Design-of-Experiments (DOE) with experience in using statistical packages such as Minitab, JMP etc. · Experience in using at-least one of the following programming languages: Matlab, Python, Labview, C++ etc.