Advanced Package Design Engineer
We are looking for an Advanced Package Design Engineer to join our team. Ensuring Synopsys IP test chip packages meets performance requirements. Candidate with advanced package design and model extraction experience required. Can-do attitude, quick learning, and solid electronic skills are assets. You will be working with a global, high skilled and very supportive team.

ResponsibilitiesResponsible for advanced package designs, such as silicon interposers, RDL fanout packages and silicon bridge packagesModels, and analyze advanced package designs and their associated PCB designsCoordination of package design phases, and flowResolves a wide range of issues in creative way regularlyProvides regular updates to manager on project statusRepresents the organization on business unit projects
RequirementsBachelor’s degree in electrical or Electronic EngineeringMinimum of 5 year of relevant experienceAdvanced circuit and transmission line theory knowledgeExperience with 3DIC packaging and 3D field solvers (e.g., HFSS)Good verbal and written English communication skillsFamiliarity with both Windows and Linux operating systems
Our Silicon IP business is all about integrating more capabilities into an SoC—faster. We offer the world’s broadest portfolio of silicon IP—predesigned blocks of logic, memory, interfaces, analog, security, and embedded processors. All to help customers integrate more capabilities. Meet unique performance, power, and size requirements of their target applications. And get differentiated products to market quickly with reduced risk.