An organization within Northrop Grumman’s Payload and Ground Systems (PGS) division, Cutting Edge Optronics is a leading provider of high-power laser diode arrays, high power pump modules and diode-pumped solid-state (DPSS) lasers. We are a vertically integrated manufacturer capable of supplying unmounted diode bars, packaged laser diodes, DPSS modules, laser diode drivers and complete DPSS laser systems. Our diode laser-based products have become industry standards and are used in a wide variety of commercial and military applications.
Learn more about Cutting Edge Optronics at our website: https://www.northropgrumman.com/who-we-are/cutting-edge-optronics/.
Northrop Grumman - Cutting Edge Optronics (CEO) is looking for a highly motivated Lap and Polish operator. The Lap and Polish operator will perform operations associated with lapping and polishing wafers. Some work takes place in a team-oriented cleanroom. Responsibilities are subject to change dependent upon your personal experience/strengths and specific needs of Cutting Edge Optronics.
Responsibilities:
Perform a variety of tasks related to operating specialized equipment to precisely grind and polish wafers to the required thickness and surface finish
Read and follow work instructions or other materials to determine specifications and inspection procedures
Adjust machine parameters to achieve the desired surface finish and thickness removal rate
Continuously monitor machine readings and quality control metrics and make necessary adjustments.
Maintain detailed logs of process parameters and inspection results to identify trends and troubleshoot issues
Perform routine cleaning and calibration of equipment to maintain optimal performance
Adhere to strict safety procedures relating to handling hazardous materials
Meticulous attention to detail and adherence to strict quality control standards
Notify supervisors or other personnel of production problems
Basic Qualifications:
High school diploma or equivalent and 1 year of experience.
Strong visual acuity and attention to detail
Good oral communication and interpersonal skills
Able to follow written operational procedures
Cleanroom experience
Willingness and capability to learn new tasks
Preferred Qualifications:
Prior Semiconductor wafer processing experience
Experience using a stereo zoom or high-power microscope
Experience with Microsoft Office software (Outlook, Word, Excel, and PowerPoint)
Salary Range: $32,100.00 - $53,500.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.