We have an outstanding Contract to Hire position for a Lead Electronics Design Engineer to join a leading Company located in the Grand Rapids, MI surrounding area.
**U.S. Citizenship is required.**
In this role you will be conducting and mentoring experienced design engineers in board-level circuit design, integration, verification, and documentation of leading-edge aerospace processor and/or FPGA assemblies. 
This is both a leadership and hands on role! You will be expected to be able to contribute at all levels of the design cycle. In this role, you will work within defined parameters to make decisions, apply concepts to complex issues, and resolve them through immediate action or short-term planning.
Job Responsibilities:  Responsible for architecting moderately complex avionic computer hardware systems that include both digital and analog components.Maintain specialized knowledge in semiconductor processors, System-on-Chip, and FPGA component architectures.Have In-depth knowledge of hardware design best practices and integration with electronics manufacturing; have working knowledge of competition and the factors that differentiate them in the market.Participation in hardware design architectural trade studies, reviews and proposals.Uses judgment to make decisions or solve moderately complex tasks or problems in hardware design, manufacturing, or technology.Takes new perspective on existing solutions.Uses technical experience and expertise for data analysis to support recommendations.Uses multiple internal and limited external sources outside of own function to arrive at decisions.Acts as a resource for colleagues with less experience.May lead small projects with moderate risks and resource requirements.Explains difficult or sensitive information; works to build consensus.Developing persuasion skills required to influence others on topics within field.
Basic Hiring Criteria:Bachelor's degree from an accredited university/college in Electrical or Computer Engineering with 6+ years of professional experience in design.
Desired Qualifications:Master's degree in Electrical Engineering with 8+ years of professional experience in digital design.Proven history of architecting complex digital hardware.Knowledge of board-level digital design processes, from schematic capture to implementation, integration, and verification.Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR4 memory, and flash memory.Experience with large pin count devices, 1000+ pins with 0.8mm device pitch or smaller.Experience in High-Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.Experience in the design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics).Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN.Experience with OpenVPX and PIC-SIG standards.Experience in the Mil/Aero/avionics, DO-254 and Civil FFA Certification.Strong professional technical writing and technical communication proficiency.Ability to break down complex problems and apply critical thinking.Familiarity with the Mentor Graphics Expedition Enterprise and Hyperlinx PI/SI.Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.