Summary:

Manual placement of components in a clean-room environment, to manufacture high-reliability microelectronic devices.

 

Essential Duties and Responsibilities:

Read and interpret assembly instructions, drawings and work instruction processes. Written tests for ESD + Manual Die attach and Sub Attach requirements. Use tools such as fine tipped tweezers, x-acto knives, vacuum pencils, dental probes, calipers, scales. Handle fine pitched micro electronics components such as dies, air-bridge dies, capacitors, resistors, substrates, hybrids.  In addition handle epoxy and cut performs for the purpose of assembly of the above mentioned components. Knowledge of how to open and close die waffle packs and handle air-bridge die gel packs. Hand apply epoxy and solder on densly populated substrate pads without disturbing epoxy on neighboring pads. Manually place above mentioned components on substrates without disturbing neighboring wet assemblies. Attach loaded /unloaded substrates into case using performs and hot plate. Work with sikama reflow equipment and ovens. Use hot plates and other tools to remove dies and other components from the substrate for the purpose of rework. Perform rework- removing epoxy, die and other components from the substrate and applying fresh epoxy and installing new components using the above mentioned tools, hot plate etc. Inspect - to the prints and procedures – the epoxy placement, microelectronics component assembly and substrates for defects before starting the assembly and after finishing his/her part of the assembly. Adhere to all ESD and other handling requirements. Comply with all in-house training as identified in job specific family and or specific training plan. Follow company 6S and continuous improvement (kaizen) objectives. Perform all other duties, as assigned.