Position: Materials Lab Analyst Intern
Number of Position(s): 1
Duration: 10 weeks 
Date: June 2, 2025 – August 8, 2025
Location: On-site

 

EDUCATIONAL RECOMMENDATIONS

Currently a candidate for a  Bachelor's degree or higher degree diploma in Materials Science or Materials Engineering, Industrial Engineering, Mechanical Engineering, Chemistry or Physics , or a related field within an accredited school in the US.  

Experience with metallographic sample preparations and microscopic methods for documentation Solid understanding of the materials of electronics products and/or corrosion science  Interest in hands-on laboratory experimentation and testing

It would be nice if you also had:

Working knowledge of surface mount solder assembly processes Familiarity with Pb-free solder alloys, particularly low-melting Bi-Sn alloys  Planning and assembling of test samples and test fixtures

 

As a part of our team, you will be involved in: 

Characterization of Pb-free solder joints using metallographic cross-sectioning and optical and scanning electron microscopy. Microstructural evolution of solder joints to assess long-term performance. Correlation of surface mount assembly process parameters and thermal cycling.