Summary: Seeking a Mechanical Engineer with extensive experience in electronics packaging design and aerospace industry qualifications for product development lifecycle management.

Requirements:

Bachelor's or Master's degree in Mechanical or Aerospace Engineering from an accredited institution.

Minimum 6 years of industry experience in electronics packaging design, including thermal, vibration, and stress dynamics.

Progressive aerospace industry design, development, and qualification experience.

High-level proficiency with electronics assemblies collaboration with electrical engineers.

SolidWorks CAD and PDM expertise.

Proficiency with FEA CAD tools like Ansys Mechanical and SolidWorks Simulation.

CNC manufacturing experience.

Knowledge of EMI/EMC mitigation techniques.

Responsibilities:

Responsible for mechanical design of products through all development phases.

Manage initial concept design through requirements definition, detailed design, simulation, analysis, manufacturing, testing, qualification to in-orbit support.

Conduct mechanical simulations and analyses including thermal management design and precision machining principles.

Perform thermal simulation and analysis alongside shock and vibration simulation and analysis.

Apply EMI/EMC mitigation techniques as well as GD&T for optimized mechanical designs using FEA.