Mechanical Engineering Technical Leader
Cisco Systems
Who We Are
We are the Service Provider (SP) Mechanical and Thermal team responsible for the design of Cisco’s best high-performance, provider class routers, the Cisco 8000 series. The Cisco 8000 series utilizes Cisco’s revolutionary Silicon One ASIC that delivers unmatched performance and density with feature-rich functionality.
We are transforming the industry and building a new internet for AI networks and the 5G era, providing a unified, programmable silicon architecture that is the foundation of all Cisco's future routing products.
Our devices are designed to be universally adaptable across service providers and web-scale markets, designed for fixed and modular platforms. Our devices deliver high speed without sacrificing programmability, buffering, power efficiency, scale or feature flexibility.
You'll be part of our group driving our game-changing next-generation network devices built with Cisco Silicon One™.
What You'll Do
In this role, you will have the opportunity to work on the platform engineering mechanical team in San Jose, CA. The job involves working on current and next-generation mechanical designs of telecom systems. We are looking for you who strive in a dynamic environment. You will be part of a dedicated team. Open communications, empowerment, innovation, teamwork, and customer success are the foundations of the team.
High-Level Responsibilities: Architect, design, and deliver next generation chassis and cards that meets system product requirements.Perform detailed 2D tolerance analysis for complex electro-mechanical assemblies using spreadsheet and/or 3D tolerance analysis tool such as CETol.Design and develop innovative mechanical solutions using sheet metal, plastic, and die-cast that meets EMI, safety, and compliance requirements.Develop 3D CAD model using Creo or NX.Create detailed drawings by applying Geometric Tolerancing and Dimensioning (GD&T) principles.Lead resolution of issues by working closely with manufacturing team and suppliers, developing mitigation plans, and keeping management informed.Collaborate with cross functional teams (Hardware, Signal Integrity, CAD, Thermal, Manufacturing, etc.) to negotiate requirements and evaluate technical risks and tradeoffs.Collaborate with thermal engineers to design and implement cooling solutions.Provide technical design guidance and mentoring for junior engineers.Who You’ll Work With
You will be working very closely with the rest of our Mechanical/Thermal group, which is a dedicated team with foundations of innovation, teamwork, open communication, and customer success. You’ll also work cross-functionally with Hardware Engineering, Product Management/Marketing, Product Operations, Global Supplier Management (GSM), External Vendors/Suppliers, Manufacturing Operations, and EMS/JDM partners.
Who You Are
You are a creative and technically skilled individual with mechanical aptitude who excels in problem-solving and embraces complex challenges. You are a technical leader with a passion for design and innovation, who is also a proactive self-starter capable of working independently to turn strategic visions into reality. The successful candidate will possess excellent communication skills, a strong analytical mindset, and a collaborative spirit that emphasizes listening, compromising, and uniting with a team to discover optimal product solutions.
Minimum Qualifications: Bachelor’s degree in Mechanical Engineering or equivalent and 8+ years of experience designing electronic enclosures.3+ years of relevant experience in design of compute/networking products.Expertise in use of 3D MCAD tools (Creo/NX).Experience with sheet metal design.Experience with GD&T and tolerance analysis.Preferred Qualifications:
Master’s degree in Mechanical Engineering or equivalent and 6+ years of experience designing electronic enclosures.Relevant experience in the mechanical design of computer/networking equipment for data center.Strong knowledge in manufacturing tooling for sheet metal, plastic, and die-casting.Experience in designing plastic and die-cast parts.Mechanism design experience.Experience in performing static and dynamic analysis using tools such as Creo Simulate or ANSYSExpert in tolerance analysis, Geometric Dimensioning and Tolerancing (GD&T) and statistical analysis.Experience in Model-Based Definition (MBD).This role requires being onsite in San Jose, CA at least 4 days/week.
#LI-LM4
We are the Service Provider (SP) Mechanical and Thermal team responsible for the design of Cisco’s best high-performance, provider class routers, the Cisco 8000 series. The Cisco 8000 series utilizes Cisco’s revolutionary Silicon One ASIC that delivers unmatched performance and density with feature-rich functionality.
We are transforming the industry and building a new internet for AI networks and the 5G era, providing a unified, programmable silicon architecture that is the foundation of all Cisco's future routing products.
Our devices are designed to be universally adaptable across service providers and web-scale markets, designed for fixed and modular platforms. Our devices deliver high speed without sacrificing programmability, buffering, power efficiency, scale or feature flexibility.
You'll be part of our group driving our game-changing next-generation network devices built with Cisco Silicon One™.
What You'll Do
In this role, you will have the opportunity to work on the platform engineering mechanical team in San Jose, CA. The job involves working on current and next-generation mechanical designs of telecom systems. We are looking for you who strive in a dynamic environment. You will be part of a dedicated team. Open communications, empowerment, innovation, teamwork, and customer success are the foundations of the team.
High-Level Responsibilities: Architect, design, and deliver next generation chassis and cards that meets system product requirements.Perform detailed 2D tolerance analysis for complex electro-mechanical assemblies using spreadsheet and/or 3D tolerance analysis tool such as CETol.Design and develop innovative mechanical solutions using sheet metal, plastic, and die-cast that meets EMI, safety, and compliance requirements.Develop 3D CAD model using Creo or NX.Create detailed drawings by applying Geometric Tolerancing and Dimensioning (GD&T) principles.Lead resolution of issues by working closely with manufacturing team and suppliers, developing mitigation plans, and keeping management informed.Collaborate with cross functional teams (Hardware, Signal Integrity, CAD, Thermal, Manufacturing, etc.) to negotiate requirements and evaluate technical risks and tradeoffs.Collaborate with thermal engineers to design and implement cooling solutions.Provide technical design guidance and mentoring for junior engineers.Who You’ll Work With
You will be working very closely with the rest of our Mechanical/Thermal group, which is a dedicated team with foundations of innovation, teamwork, open communication, and customer success. You’ll also work cross-functionally with Hardware Engineering, Product Management/Marketing, Product Operations, Global Supplier Management (GSM), External Vendors/Suppliers, Manufacturing Operations, and EMS/JDM partners.
Who You Are
You are a creative and technically skilled individual with mechanical aptitude who excels in problem-solving and embraces complex challenges. You are a technical leader with a passion for design and innovation, who is also a proactive self-starter capable of working independently to turn strategic visions into reality. The successful candidate will possess excellent communication skills, a strong analytical mindset, and a collaborative spirit that emphasizes listening, compromising, and uniting with a team to discover optimal product solutions.
Minimum Qualifications: Bachelor’s degree in Mechanical Engineering or equivalent and 8+ years of experience designing electronic enclosures.3+ years of relevant experience in design of compute/networking products.Expertise in use of 3D MCAD tools (Creo/NX).Experience with sheet metal design.Experience with GD&T and tolerance analysis.Preferred Qualifications:
Master’s degree in Mechanical Engineering or equivalent and 6+ years of experience designing electronic enclosures.Relevant experience in the mechanical design of computer/networking equipment for data center.Strong knowledge in manufacturing tooling for sheet metal, plastic, and die-casting.Experience in designing plastic and die-cast parts.Mechanism design experience.Experience in performing static and dynamic analysis using tools such as Creo Simulate or ANSYSExpert in tolerance analysis, Geometric Dimensioning and Tolerancing (GD&T) and statistical analysis.Experience in Model-Based Definition (MBD).This role requires being onsite in San Jose, CA at least 4 days/week.
#LI-LM4
Confirm your E-mail: Send Email
All Jobs from Cisco Systems