Position: Mechanical/Thermal Intern
Number of Position(s): 1
Duration: 10 Weeks
Date: June 2 to Aug 8, 2025
Location: Onsite 

 

EDUCATIONAL RECOMMENDATIONS 

Currently a candidate for a Ph.D or Master’s, in relevant fields to engage in the research and development of mechanical and thermal hardware solutions for next-generation wireless communication and sensing systems, or a related field with an accredited school in the US.

Expertise in 3D CAD software (Creo, Solidworks, or equivalent) Expertise in thermal and/or mechanical simulation and analysis software

It would be nice if you also had:

Familiarity with ANSYS Icepack, FloTHERM, or equivalent simulation software for electronic components Familiarity with Ansys Mechanical or equivalent simulation software for mechanical integrity and reliability modelling of electronic components Experience with mechanical material characterization, thermal performance testing, or reliability testing

As part of our team, you will:

The candidate will work directly with other Bell-Labs researchers/engineers and Nokia business units to design supporting mechanical/thermal hardware for various radio systems operating in the mm-Wave and THz frequencies for 6G and beyond.  The candidate must be competent in 3D CAD design software and technical drawing generation Perform mechanical integrity and thermal simulations, tolerance analyses, and characterization The candidate must be able to work well and efficiently within a larger team with strong interpersonal skills and collaborate with other teams in Bell-Labs.