Johnson Service Group is an award-winning staffing company that is looking for a Microelectronics Assembler with 1-3 years’ experience doing Wire bonding and Die attach. This is a Temp-Direct opportunity for a Microelectronics company in Simi Valley, CA.

Pay Rate: $28.00 HR
  Perform a variety of micro-chip and wire assembly operations under a microscope. Perform manual die bonding, wire bonding, ribbon bonding or other cleanroom operations. Knowledge of manual/automatic wire bonding, manual die bonding machines or any automatic electronic assembly equipment is a plus++. This position requires steady hands for handling ultra- miniature parts which may only be visible through microscope. The applicant must have good eyesight and manual dexterity. Use small hand tools such as tweezers and pin probes under a microscope is required. The ability to read and interpret assembly drawings, operation instructions and assembly procedures is required. Assist in meeting department production goals and work in a team environment. Most of the work will be performed in a clean room environment. Job Qualifications - Education/Experience: 1 to 3-years working as a Micro assembly/Mechanical assembly preferred or related experience. The Micro-Assembler will work closely with Engineering, Test and Inspection and will receive on-the-job training as needed. Able to work independently and within a team High school diploma or equivalent US Citizenship required
** Johnson Service Group (JSG) is an Equal Opportunity Employer. JSG provides equal employment opportunities to all applicants and employees without regard to race, color, religion, sex, age, sexual orientation, gender identity, national origin, disability, marital status, protected veteran status, or any other characteristic protected by law.
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