**Job Description** You don t see it, but it s there. Our employees work on the world s most advanced electronics from saving emissions in the City of Lights to powering the Mars Rover to protecting the F-35 fighter jet. At Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems. Drawing strength from our differences, we re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first exemplified by our missions: We Protect Those Who Protect Us and We Innovate For Those Who Move The World TM . Sound like a team you want to be a part of? Come build your career with us. Our Manassas, Virginia team has an opening for a Microelectronics Packaging Intern within our Hardware Engineering team. This position will help to develop the most advanced radiation hardened computer processors, ASICs, and FPGAs to support our Space Systems line of business. We are seeking team players with strong interests in supporting package design for high reliability missions. Our team processes 10,000 to 13,000 flight packages per year in Manassas, VA, while increasing our capabilities in higher I/O pin counts, high-speed logic, and high-density memory. Our team supports a variety of packaging concepts including flip-chip, single chip wirebonds, hyrbid stacked, component join (TSOP), CGAs, and leaded/leadless packages. This position is targeted towards Electrical or Mechanical Engineering interns. You would be a member of the team whose products have been deployed in commercial, civil and national security space missions; including GPS, weather monitoring, satellite TV and radio, exploring the universe; most notably the Mars rovers, Spirit and Opportunity. Additional work opportunities would include electronic warfare technology to deliver superior situational awareness, even in the most complex battlespace defeating threats long before they can be seen. With this job, you will have the opportunity to be an integral part of developing hardware from concept to deployment. **Required Education, Experience, & Skills** + Must have a passion and desire to work in the field of Microelectronics + Strong written and oral communication skills + Self-starter and a good team player + Ability to mentor and willingness to be mentored + Working towards a Bachelor s Degree in Electrical or Mechanical Engineering **Preferred Education, Experience, & Skills** + Experience in leading a design team + Experience in hardware design and hands-on lab debug + Classes or extracurriculars that specialize in Microelectronics/Packaging + Experience and willingness for lab testing + Working towards an advanced degree in Electrical or Mechanical Engineering **Pay Information** Full-Time Salary Range: $48620 - $65670 Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20 hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance. **Microelectronics Packaging Engineering Intern** **107981BR** EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression