Nokia’s Network Infrastructure group is at the heart of a revolution to bring more and faster network capacity to people worldwide through our ambition, innovation, and technical expertise.

The Optics Subsystems group develops the frontends for coherent optical long-distance transmission modules to interconnect network nodes and data centers. We are expanding and looking for highly motivated and experienced engineers to join us to develop the next generations of transmission systems. 

Within Optics Subsystems, the SoC (System-on-Chip) team members architect, specify, design and test the ASICs for the optical modules. Our main goal is to extend the optical reach and transmission bandwidth and at the same time reduce the power and floorspace needs by using the latest chip technologies.

Sounds interesting?
Be sure to check out details about our latest developments, the Photonic Service Engines:
https://www.nokia.com/networks/technologies/photonic-service-engines/

 

Master’s degree or PhD in Electronic Engineering, Telecommunication Engineering. 10+ years of demonstrated experience in deep sub-micron analogue CMOS design (<10nm). Experience in high speed analogue CMOS design (>15GHz). Experience in verifying and bringing up complex analogue IPs and test devices. Very good understanding of technology constraints and layout parasitics. Basic RFIC experience (EM extraction, impedance matching, narrow-band design techniques). Mixed-signal design, along with Verilog-A, AMS, System Verilog functional modeling skills. Matlab (or similar) modeling skills for performance modeling and test automation. Analytical thinking. Ability to work in a multi-site international team. Effective communication. English (mandatory) . Developing high-speed analogue IPs in deep sub-micron CMOS technologies. Depending on experience, taking responsibility for the whole IPs or large sections of them. Mentoring circuit and layout design engineers. Contributing to and co-designing complex state of the art electronic devices for Optical Communications. Supporting multiple cross-functional teams working on system design, optical, digital and DSP design, ASIC integration, package integration, module and product design. Testing and documenting own design work.