Key Responsibilities:

Define the architecture for co-packaged optics, including specifications, optical engine block diagram, mechanical and thermal requirements, electrical/RF routing, etc.  Define the integration processes for co-packaged optics, including both front-end fabrication processes and backend integration/assembly processes such as bumping, flip-chip die attach, 2.5D and 3D assembly, multi-chip hybridization. Knowledge and experience in optical coupling efficiency, signal integrity, and thermal modeling are great advantages  Work with optical/RF/thermal/mechanical engineers on designing co-packaged optical modules Work with substrate engineer on co-design substrate with die attach features such as solder pads, UBMs, solders, optical fiducials Design multi-chip hybridized optoelectronic IC’s integration processes.  This integration process includes flip-chipped lasers, silicon photonic IC’s, high speed analog and digital IC’s on specialized substrates.  Document key R&D results for IP protection as well as work instructions for operations.

Qualifications:

Bachelor’s degree or higher in Applied Physics, Electronics Engineering, Optoelectronics Engineering, Material Science or related fields.  Equivalent industry experience is also applicable. At least 2 years industry experience with optical transceiver assembly, silicon photonics, and optical and IC packaging  Ability of using thermal modeling and mechanical modeling tools for tolerance analysis, CTE mismatch analysis, and long-term reliability analysis. Experience with high-speed electronics package design and/or laser package design. Working knowledge experience in 2D, 2.5D, and 3D wafer scale assembly. Experience with SolidWorks and thermal analysis tool. Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes  Experience with Oracle, Agile, and MS Project desirable Working knowledge and experience with manufacturing support, such as optical component testing and performance evaluation  Highly self-motivated with a strong multi-disciplinary background is essential  Strong problem solving, critical thinking, and risk management skills  Strong communication, planning, and organizational skills Authorized to work in US