Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JOB DESCRIPTION: 

Micron’s Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the path finding of innovative package technology : Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB(Thermal Compression Bonding ), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally the hands on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

JOB REQUIREMENT

Experience needed :

More than 3 years experience

Family as development experience of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond are better, Grinding, SD, Dicing, Laser Grooving

Education level :

l   PhD/Masters Degree in Electrical & Electronic, Material, Mechanical, Chemical Engineering, Physics & Applied Physics, or Equivalent Work Experience Required

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.