**Company Description** Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. **Job Description** Preferred Industry: Semiconductor Manufacturing / PCBA Manufacturing Job Description : As an SMT Engineering, you will be responsible for leading and managing the activities of New products developments (SSD) from Packaging, working together with other functional groups locally and/or globally to accomplish organizational and business objectives by ensuring the Product Design and SMT processes are in control and Product meets the quality/reliability expectation; sustaining and improving the key performance indices through continuous improvement activities / projects; reducing cost through continuous cost reduction effort; strategy and roadmap; developing new capabilities ahead of needs. Roles & Responsibilities: + Strong knowledge of **SMT technology** and equipment. + Exposure to the importance of Mechanical, Thermal, Environmental impacts on the product + Knowledge on **Component Engineering, Reliability & Failure analysis** + Risk Management, trouble-shooting / root-causing complex problems + Experience on **New Form-factor Introductions and qualifications, Product Qualifications,** + Develop Technology Roadmaps + Low volume / High Volume Manufacturing Bring-up + Knowledge on SMT Line setups , programming of SMT Cards Preparing of new SMT stencils & stencil optimisation + **Knowledge on process / materials for introducing new paste & new product.** + Knowledge on **reflow Profile & its optimisation** . + Knowledge on BOM and its setup + Agile / ERP tool usage knowledge + Coordination with CFT and factory for effective product delivery + Analyse HW designs and ensure manufacturability and meeting the customer reliability requirements from process point of view. + Knowledge on different Packages and its influences on the SMT /reliability + DFM, DFA + Managing time constraints and meeting tight product development /NPI deadlines, keeping the Manufacturability /quality expectations. + Capable of performing Root Cause Analysis using basic Quality Tools for solving the process/equipment issues. + Attention to the details and ability to analyse and interpret data. + On top of rapidly evolving technology and industry trends + Experience in handling Customer complaints, and run TF till issue closures. + Good analytical skills. + Experience in Memory industry is a plus + Good knowledge in MS Office and good communication skill. + Excellent verbal and written communication skills. **Qualifications** Designation: Principle Engineer Experience : 10 ~15 Years Preferred Industry: Semiconductor Manufacturing / PCBA Manufacturing + B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering + Solid knowledge through academic coursework subjects + Background in applied mechanics with emphasis on both analytical and computational methods. + AutoCAD courses + Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder). + Demonstrated strong work ethic. + Excellent communication and coordination skills, able to present the complex design structures in a clearly understandable narrative. + Ideal candidate would have a broad knowledge of memory industry and trends. + Working knowledge in hardware/systems integration. + Prior program management experience managing multiple stakeholders. Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development **Additional Information** Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.