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Job Description

We are looking for a Principal Integration Engineer to join our talented cross-functional team and manage wafer fab processes for fabrication of III-V Semiconductor Laser optical components, used in fiber optical communication, industrial laser and AI applications. The Integration Engineer will be responsible for the successful implementation of designs into functional chips.  This requires collaborative working with staff from a wide range of engineering teams with many different skills to solve challenging problems with real commercial impact.

In this position you will:

Integrate processing steps to realize new III-V based products for both coherent and direct detection photonic semiconductor components, using existing and new wafer fab processes.Deliver NPI projects on schedule per Gate Review timeline.Lead improvements of existing wafer fab processes for yield, cost and / or cycle time.Document and release process flows / procedures on the wafer fab MES system.Play a critical role in supporting yield target and deliver the expected outcome in conjunction with Manufacturing Engineers.Use of analysis tools, such as SEM, to understand processes and trouble shoot process issues.Develop new process modules for realizing novel chips, and ensuring these processes are robust and manufacturable in volume.You will be responsible to transfer new process steps and new chips into manufacturing on time per Gate schedule.Analyze and document product / processes using Six Sigma techniques such as FMEA, capability analysis, design for manufacture/yield, etc.Report and maintain wafer process performance target with statistical evidence for manufacturability, such as CPK, PPK, etc.Act as the interface between the design team and operations engineering and manufacturing teams. Successful candidate will be responsible to ensure DFMEA is completed prior to Gate release.Serve as the process expert for the chips, even after transfer to production control. Support daily production like solving issues in real-time, as well as leading the analysis of failures on the wafer fabrication and testing production line.

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Requirements:

Ph.D. degree in electrical engineering, material science, physics, or other relevant majors.In-depth practical knowledge of a broad range of III-V semiconductor wafer processing techniques. This should include several of the following areas:  lithography, dry and wet etching, dielectric / metal deposition, implant, diffusion.5+ years hands-on experience of developing whole device process flows, process integration of existing and new wafer processes.Strong statistical data analysis skills (JMP etc.).Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management etc.) in a high-volume manufacturing environment is needed.Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.Strong ability to drive actions and solutions through cross-functional teams.Able to work 100% on site and occasionally after hours to support onsite manufacturing as needed.

Pay Range:

P70-USA-1 :$124,600.00 - $178,000.00

Disclaimer:

Final base salary for the successful candidate will depend on multiple factors, including but not limited to, job location, where work will be performed, qualifications, work history and relevant experience. With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits.