Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Have you ever dreamed of contributing to the development of groundbreaking technologies? Micron has an outstanding opportunity for a high energy, tenacious, ambitious, results driven individual with a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho.

As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build program plans, and secure resources to drive process technology development programs. More specifically, develop sophisticated interconnect technology solutions that include wafer to wafer bonding, using Hybrid Bonding, or Fusion bonding. You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes. You will take ownership of these programs or projects through to deployment of technology nodes into our High-Volume Manufacturing (HVM) operations. You will develop a yield improvement and process margin improvement roadmap to ensure extended engagement with manufacturing to insure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with alignment of leaders and partners and demonstrate the ability to guide individuals towards project objectives. You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. You will need to embrace change and volatility and operate with a sense of urgency. Apply sound engineering principles and judgement, seek advice from experts and make critical and timely decisions. You will need to advise and lead the work of others and ensure good communication, engagement and accountability leading to achievement of the program goals.

Responsibilities and Duties include, but not limited to:Line MonitoringProject managementYield improvementDeveloping new line monitoring methods and processesData miningDetermining critical metrics for line monitoringUse Micron systems for conducting experimental work and documenting outcomesAnalysis of results from experiments and providing clear and practical recommendations or decisionsWriting Engineering Change Notices and Change Management Documents (ECN and GCP)

Leading problem-solving activitiesPerform Kempner-Tregoe (KT) or KT-like problem solving and decision-making processDefine and execute Design of Experiment (DoE)Communications - same site and site-to-sitePresent to others

Coordinating conversion timelinesDevelop and innovate, establish contingency plansDrive process innovation for best in class solutions and cost driven technologyVertical integration capability to define highly complex process flowFocus on reliability and a “shift left” mentality and approach to technology development

Coaching & MentoringCoaching and mentoring early and mid-career engineers (E1-E3) and techniciansInstructing classes as needed

Growth MindsetContinue to build new skills through development goals and learning eventsSeek out opportunities to work multi-functionally, build a network, and gain competency across domains

Qualifications and SkillsAt least 5 years experience in advanced packaging industryDegree/Major: MS or Ph.D. in Electrical, Computer Engineering, Chemistry, Physic, Material or related fieldDeep knowledge advanced package integration and DRAM or other memory. (3DIC, FO, Hybrid bond...etc)Excellent data extraction, analysis and reporting skills. (System analytics, JMP…etc)Ability to be flexible with job responsibilities and take the initiative to assume added responsibilitiesSuccessfully demonstrated collaboration skills with a focus on developing good team dynamicsSkill at effectively prioritizing multiple and sophisticated tasks.Good communication skill to align the perspective through multi-functional teamsTenacity to work effectively under tight timelines and limited resourcesAbility to self-direct and measure with minimal directionFluent communication in English

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.