The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and a particular chip bonding, 3D integration, Systems on Chip and Systems in Package – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors.

Key job responsibilities
Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in sound engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in wire-bonding, flip chip bonding, SoC and SiP techniques and tools. Working effectively within a team environment is critical.

A day in the life
The candidate will spend most of the day in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects.

About the team
A fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips and implementing groundbreaking process innovations.