Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
JR49196 Senior/Engineer, PDE Technology Development (Evergreen)Micron is seeking a highly motivated and experienced individual contributor to join our Assembly Package Technology Development (TD) team. As a Senior/Engineer in the Process Development team, you will play a crucial role in developing and qualifying new materials, equipment, and wafer tech nodes for Micron's world-class products and devices.
Job Responsibilities:
Primarily responsible for Cleanroom 1 (CR1) Area processes such as Wafer Grinding/ Stealth Dicing/ Laser Groove/ Die Separation/ and Wafer Saw, Cleanroom2 (CR2) area processes (Die Attach / Flip Chip / Wire Bond / Underfill / Surface Mounting Technology) or Cleanroom 3 Area processes (Pre-Encapsulation Plasma / Encapsulation / Post Mold Cure / Laser Marking / Ball Attach / Reflow / Flux Washer / Package Singulation / Assembly Open and Short Test).Development and Qualification of new direct and indirect materials, equipment, and wafer tech nodes.Ensure product quality and process performance while driving projects focused on cost reduction, productivity improvement, risk mitigation, and resolving manufacturing challenges.Collaborate or lead teams from various departments to ensure smooth development transfer to all Micron network sites.Familiarize and implement PMI (Product Maturity Index) methodology and provide accurate documentation for product transfer.Develop, configure, and optimize Package Assembly processes (Front End, Bonding, and Back End) for Micron's memory products from pathfinding to NPI start-up and certification while collaborating with the global design team.Requirements:
Masters/bachelor’s degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent work experience required.At least 5 years of experience in the semiconductor industry with proven knowledge, understanding, and skills in wire bond/wafer thinning and sawing/encapsulation processes.Excellent problem-solving skills and familiarity with data-driven analysis, statistical analysis, and data interpretation.Strong project management skills and ability to multitask to ensure the execution of timelines.Strong collaboration skills to work closely with diverse teams and gain insights into business needs and customers' requirements.About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
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