The Field Application Engineer leads process-related application efforts for our customers’ new applications, new product developments, and field-sustaining issues.
•    Customer engagement and application feasibility studies: Collaborate with Sales and Technical Solutions Managers on our customer application requests. Produce evaluation report on the application study. 
•    Assist with research and development projects to advance wedge bond interconnect solutions: Work closely with the development team to study new equipment capabilities and develop new processes. Serve as the local area expert and execute new product deployment in the field.
•    Process troubleshooting and sustaining support: Analyze, troubleshoot, and resolve 2nd level escalated field support issues. Provide technical consultation to customers and internal teams on wedge bond processes.
 

Work closely with sales and marketing to assess potential applications of our products through rapid prototyping and product demonstrations.  Assist customers with sample build requests and support research and development projects to enhance wedge bond interconnect solutions.  Participate in onsite and/ or offsite demo bonder qualifications, Alpha and Beta tests for potential customers.  Plan and conduct tests to address process knowledge gaps and develop best-known methods for new and existing processes.  Share product knowledge within the applications team during product development projects.  Provide technical consultation to customers and internal teams on wedge bond processes and support sustaining issues.  Offer pre-and post-sales technical support, working with customers from initial contact through delivery and installation.  Prepare and present technical reports, concepts, data, and recommendations to management, customers and participate in technical seminars with the sales and marketing team. Bachelor’s, Master’s, or PhD in Materials Science, System Engineering, Electrical or Mechanical Engineering, or Physics.  Experience with Six Sigma methodology and statistical tools (Excel, Minitab, JMP) is a plus. 2 to 5 years of experience in manufacturing, engineering, or research development. Experience with semiconductor packaging or hybrid microelectronics assembly is a plus.  Knowledge of Python programming and electro-mechanical systems is beneficial.  Experience with the Design of Experiments (DOE), ultrasonic bonding, and clip-attach processes is a plus.  Effective verbal and written communication skills in English; proficiency in Mandarin or other Asian languages is a plus.  Ability to work independently and cross-functional collaboration environment, with a positive attitude and open mindset, flexible to adapt to changes in tasks and work environment. Willingness to travel locally and internationally up to 25% annually for on-site technical support.

Company overview:

Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets. 

Please refer to the website for more details: www.kns.com.

Equal Opportunity:

Kulicke & Soffa recruits on the basis of merit (such as skills, experience or ability to perform the job), regardless of age, race, gender, religion, marital status and family responsibilities, or disability.

About the Application Team in SG

The application team is responsible for leading process-related application efforts for new applications, new product developments, and field- sustaining issues We play an integral role in partnering the sales and marketing team   in acquiring new business opportunities and the sustaining team in defending our market share by leading new application and qualification efforts, contributing to development projects, and providing process consultation for field issues.