Project Kuiper is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to un-served and under-served communities around the world.

Come work at Amazon!

As Senior RF ATE Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
You’ll be responsible for RFIC high-volume production test methodology of mm-wave RFICs for Project Kuiper custom silicon. You’ll be part of the team that creates a chip and system test infrastructure and methodology applicable to transmit and receive communication systems.

Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.


Key job responsibilities
- Write test plans and test programs for mm-wave SoCs tested on Teradyne and Advantest equipment.
- Review device specifications, collaborate with the design team to apply design for test principles to ensure product manufacturability.
- Define load board, socket, and probe card designs for best layout practices and possible signal / power integrity issues.
- Architect high-volume test solutions across DUT firmware and tester software to optimize total test cost.
- Actively identify test related readiness, issues, and optimizations throughout the product lifecycle and work towards expedient resolutions.
- Own the optimization, standardization, and improvement of test methodologies to enhance operational efficiency in production, ensure product quality and minimize cost.
- Work with lab bench mm-wave test systems to correlate bench and ATE results.
- Define test plans and limits for production lots, corners lots, and pre-/post-qualification lots.
- Develop and transfer to volume production RF and high-speed digital die probing techniques to improve accuracy of identifying good dice and improve yield.
- Interact with suppliers such as foundries and OSATs to complete engineering programs for wafer test, final test, and qualification.