Azure’s Thermal Engineering team is looking for a **Senior Thermal Engineer** to focus on the thermal hardware design of Azure servers and related components at the server and rack level. A strong mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop thermal hardware to effectively manage high performance data center devices. You will work with internal and external partners, focusing on delivering the next generation of world class data center hardware. Relocation assistance is available to Redmond, WA within the Unisted States. **Responsibilities** **Key responsibilities:** + Collaborate with internal and external partners across the globe to design hardware systems for the thermal management of Azure servers and related devices. + Build, conduct thermal simulations, and review thermal simulation models from ODM partners to identify risks and improve thermal design solutions. + Lead Thermal design reviews and presentations of concepts to peers, partner teams, and executives. + Work jointly with multidisciplinary teams consisting of both in-house and external companies in the development of concept prototypes. Follow through with production development organizations to drive concepts onto the roadmap and into Azure’s fleet. + Collaborate with multifunctional engineering groups to deliver hardware that meets the related product thermal specification. + Collaborate with firmware and controls engineering teams to create robust Thermal control and monitoring systems. + Conduct design/debug investigations and support failure analysis and resolution activities. + Design and create thermal test plans. Collaborate with technicians and industry partners to complete tests. Analyze test data to validate product qualification. + Embody our Culture (https://www.microsoft.com/en-us/about/corporate-values) and Values (https://careers.microsoft.com/us/en/culture) **Qualifications** **Required/Minimum Qualifications** + 7+ years of technical engineering experience + OR Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years of technical engineering experience + OR Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years of technical engineering experience + OR Doctorate degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field. + 7+ years of industry experience related to thermal systems design and development. + Understanding of thermal and mechanical design principles, fluid dynamics, pumps and compressors, mechanical vibration and shock, valve and manifold design, material compatibility, manufacturing processes, and validation + 7+ years of experience with Thermal/Fluids simulation using Ansys/Fluent/Icepak and/or Siemens/Mentor products **Other Requirements:** Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: + Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter. **Preferred Qualifications:** + 7+ years of experience in the electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers electronics industry specifically related to high-powered liquid cooled servers + 2+ yrs experience with a thermal simulation tool ( e.g; Flotherm, Ansys, Icepak, etc.) + Experience with prototyping, thermal design and development, and high-volume manufacturing of electronic enclosures + Experience partnering with and overseeing ODM engineers + Experience in pump design, fluid loop sensors and controls, heat exchanger design + Familiar with CAD software tools PTC Creo, Windchill or similar software (ie Solidworks, Catia) Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $117,200 - $229,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $153,600 - $250,200 per year. Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay Microsoft will accept applications for the role until October 28, 2024 \#CAASE #SCHIE #azurehwjobs Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .