Company:Qualcomm Technologies, Inc.

Job Area:Engineering Group, Engineering Group > ASICS Engineering

General Summary:

Join QCOM Technologies Inc vibrant Global CAD team pushing the limits of Signoff solutions for the Snapdragon chips powering billions of mobile devices.  The position requires Signoff PDN experience in IR drop, Electromigration (EM) or/and Thermal and CAD development skills to define and develop tools and methodologies for accuracy, compute, in close collaboration with Snapdragon Physical Design and Timing/PDN teams. Qualcomm is using leading edge internal and EDA technologies in the Signoff domain, including pioneering in genAI/ML, and developing good-by-construction hierarchical solution, as well as enabling the latest STA, IR, EM, Thermal features to reduce conservatism in Signoff.

This role’s responsibilities will include:

Improving the PDN methodology for diverse Mobile, Compute, AI, IoT Snapdragon chips: accuracy of IR, EM, ESD, Thermal signoff analyses, reduction of ECO loops for EM/IR fixing, enabling hierarchical
PDN signoff, reducing the compute and memory requirement of the PDN signoff analyses.Developing automation and enablement of new features for the foundry advanced process nodes, collaborate with AI team on ground-breaking initiatives for compute and turn-around time reduction.Provide solutions to the Snapdragon design teams, analyze their requests, and address their requests through ticket queues.Interfacing with EDA vendors to enable production-ready tool sets that satisfy project’s requirement.Setting up, augmenting, and maintaining a regression of complex STA and PDN designsCorrelation of STA tools with spice, and of PDN tools with solver and spice, version-to-version validation.Innovating on PDN and Timing techniques and any adjacent domains, leading to participation to patents.

Preferred Qualifications:

Bachelor’s degree or Masters degree or PhD in Computer Engineering, Electrical Engineering, or related field.1-4 years of experience in Signoff PDN or/and Timing of SoCs at either top-level or block-level. 1-4 years of experience with scripting tools and programming languages: Python and TCL preferred.Experience and exposure on PDN analysis tools such as Ansys Red-Hawk-SC (RHSC) or Cadence Voltus.

Principal Duties and Responsibilities:

Participate to the PDN flow and features enablement for foundry advanced process nodes, at block, subsystem, and top level.Participate to the enablement of new methodologies and features for turn-around time reduction on various subsystems such as Modem, GPU, CPU, DDR, Camera, Video, NSP.Interface and drive EDA vendor Application Engineers on the resolution of Signoff problems faced by the Snapdragon design teams.Participate to the specification of new Signoff CAD solutions addressing the PPA requirements of the design teams.Deep dive on IR, EM, ESD issues, through tickets and task forces etc.Participate along with Qualcomm talented AI team to R&D initiatives driving differentiation in terms of compute and turn-around time. 

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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Pay range and Other Compensation & Benefits:

$98,500.00 - $147,700.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.