Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR71020 SR ENGINEER, PACKAGE MATERIALS

As a PDE Senior engineer of Package Characterization Engineering, you will be primarily responsible for defining, pathfinding and explore new packaging materials for Micron future market segments in AI, Immersion cooled and cryogenic memory high-performance computing. This includes to improve packaging quality and reliability, working on materials characterization methodology, benchmarking on new test methodologies, and materials reliability risk management. You will also be required to identify, diagnose, and resolve potential failure mechanisms with respect to packaging materials. Additional responsibilities include leading and participating in second source, cost reduction activities, handling new process baseline characterization, benchmarking external lab capabilities, and liaising with material suppliers to achieve quality, etc.

Responsibilities

Collaborate with die attach material suppliers in meeting Micron materials specification and roadmaps. Own overall material characterization planning and execution. Collaborate with taskforce team on materials and package characterization. Take the lead in driving resolution of issues encountered during package characterization. Package characterization tracking and forecasting for new package NPIs, post reliability survivor analysis. Be the Point-of Contact pertaining to all aspects of products/packages associated with die attach materials. Develop strategies to drive materials improvement.Responsible for pathfinding of new frontier materials used in future Micron market segments such as AI, high-performance computing, future immersion-cooled datacenter applications.

Requirements

MS/PhD in Mechanical/ Chemistry/ Physics/ Materials Science / Chemical EngineeringHighly motivated individuals with 5+ years of relevant working experience are encouraged to applyFamiliar and well-versed in component level, board level packaging and/or materials characterizationExperience and familiar with industrial Consortia such as IEEE/ JEDEC/ SEMI Technical Conferences and Seminars would be a plusPreferably candidate/s with IEEE conference paper publication, patent filing and journal publicationGood understanding of package reliability testing and material scienceA team player equipped with excellent interpersonal and communication skills.Possess initiative and ability to work independently.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.