Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR52641 SR ENGINEER, TDT PD DRY ETCH

Job Description

At Micron's Technology Development (TD) organization, we strive to pioneer groundbreaking plasma etch processes for our brand-new memory technologies. As a Senior/Principal Dry Etch Process Development Engineer in Technology Development Taiwan (TDT), you will have the outstanding opportunity to develop innovative etch processes from conception to implementation in our production facilities. Join our world-class teams to build robust etch processes that meet Micron's strict physical and electrical standards.

Responsibilities:

Develop critical Dry Etch processes to meet structural and electrical requirements such as Shallow Trench Isolation (STI), Self-Aligned Contact (SAC), Metal Gate Contact, or High Aspect Ratio Contact (HARC) Dry Etch recipes.Deliver advanced technology in a timely manner to meet future product nodes and maintain Micron's competitive edge.Collaborate with multi-functional teams to collectively develop device structures and support multi-functional failure analysis and yield improvement.Lead and collaborate on technology transferring activities between TD and fab engineers, ensuring seamless integration and flawless performance.Manage wafers through Dry Etch processes to support special requirements and update fab engineers on customer issues and technology needs.

Qualifications & Skills:

Proven knowledge or experience in dry etch processes, particularly in areas such as STI, SAC, Metal Gate Contact, or HARC Dry Etch.Proficiency in Mandarin and English languages.Strong problem solving, experimental design, and data analysis skills, with a proven track record of solving complex problems.Experience with plasma sources and processing equipment from Applied Materials, Lam Research, and Tokyo Electron Limited.Expertise in advanced process control, statistics for engineering, and Statistical Process Control (SPC).In-depth understanding of device physics, semiconductor processes, and metrology equipment.

Education and Experience:

A PhD or MS in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, Physics, or a related semiconductor field is required.At least 5 years of experience in dry etch process development within an R&D group, demonstrating a strong ability to successfully implement advanced technologies.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.