Sr Engineer II, Equipment & Maintenance
JOB DETAILS:
Engineer, Equipment is responsible for overseeing equipment for overseeing equipment maintenance, equipment troubleshooting, maximizing overall equipment efficiency, reducing equipment downtime by providing guidance to technicians, solving technical challenges related to automated semiconductor equipment, implementing and manage effective preventative maintenance procedures, implementing effective manufacturing methodologies such as lean/six sigma, SPC, etc., always follows domestic and international regulatory standards (e.g., GMP, 21CFR 820 and ISO 13485). Duties & Responsibilities: Technically support the maintenance, troubleshooting & overhaul of semiconductor packaging equipment such as die bonders, wire bonders, die sorters, map sorter, plasma cleaner, mold press, trim & form, laser deflash, media de-flash, automated testers, etc. implement systems for robust preventive maintenance procedures & spare parts management develop & implement systems such as OEE to maximize throughput & efficiency of each production line work with process/manufacturing engineering teams to take a data-driven approach to identify, optimize & control process variables to ensure a stable & capable process. Communicate efficiently with multiple equipment suppliers to identify & fix all equipment-related technical issues respond to and solve daily technical issues in Irvine manufacturing create training materials for engineers, technicians, and operators and train them in usage. Support process validations as required: IQ/OQ/PQ, generate protocols and test reports. Lead/support equipment transfers to Mexicali and other satellite manufacturing plants develop, implement, and support lean processes in production and throughout operations lead/support continuous improvement projects and initiatives continuously research, learn, and recommend best practices for world-class manufacturing maintain training records and always follow Masimo operating procedures.
EDUCATION AND EXPERIENCE REQUIREMENTS:
THIS POSITION REQUIRES A BACHELOR’S DEGREE (OR FOREIGN EQUIVALENT) IN MECHANICAL ENGINEERING, ELECTRICAL ENGINEERING, MATERIALS ENGINEERING, MANUFACTURING ENGINEERING, INDUSTRIAL ENGINEERING, OR CLOSELY RELATED ENGINEERING FIELD, PLUS 8 YEARS OF WORK EXPERIENCE IN THE JOB OFFERED OR IN A CLOSELY RELATED OCCUPATION.
Special Requirements:
EXPERTISE/KNOWLEDGE OF:
Ability to troubleshoot simple to complex manufacturing processes and equipment issues related to semiconductor packaging (die bonders, wire bonders, die sorters, map sorter, plasma cleaner, mold press, trim & form, laser, and media deflash, automated testers etc. Experience with introducing new semiconductor packaging equipment (specification, supplier selection, buy off, validation, maintenance & troubleshooting). Experience with Total Preventive Maintenance (TPM): elaborate & execute maintenance plans, efficient spare parts management. Conceptual, analytical, and practical problem-solving abilities to improve Yields, OEE, Down Time. CAD (Solidworks, AutoCAD) to edit/create drawings and statistical software including Minitab or equivalent. Experience interfacing with cross-functional team environments. Ability to read & comprehend electrical/mechanical machine drawings to identify faulty components. Experience with mechanical/electrical/optical products, particularly automated testers for semiconductor packages. Experienced in modern manufacturing principles and techniques (Lean 6 Sigma, process automation, Value Stream Mapping, Computer Aided Manufacturing, TPM, SMED, 5S).
MUST POSSESS EXPERTISE/KNOWLEDGE SUFFICIENT TO ADEQUATELY PERFORM THE DUTIES OF THE JOB BEING OFFERED. EXPERTISE/KNOWLEDGE MAY BE GAINED THROUGH EMPLOYMENT EXPERIENCE OR EDUCATION. SUCH EXPERTISE/KNOWLEDGE CANNOT BE"QUANTIFIED" BY “TIME.”
Salary: $136,989 - $158,000 per year.
Masimo Corporation is an equal opportunity employer.
How to apply: Qualified applicants please send resume to: Delora Sandoval: dsandoval@masimo.com. Must reference JOB CODE#: MV-25 when applying.