Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description:

An assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Candidate should be familiar with Assembly process. the experience of flip chip, TCB and the solder material is preferred for this position.

Responsibilities and Tasks:

Follow Micron's culture , PITCC , people, innovation, tenacity, collaboration, customer focus.

Help stakeholders to remove the gaps with inputs all around and connect team together to resolve the problems encounters during operations or manager's assignment

Collaborate with stakeholders to use innovative way to resolve the problems and meet top-down requirements .

To achieve the goal with tenacity manners no matter how difficult or how fuzzy it is. Define the problems, find the root cause and then, resolve it. Must have can-do mindset instead of complaints.

Plan and execute new technology enablement

Be familiar with Assembly process. the experience of flip chip, TCB is preferred.

Explore new technology on semiconductor industry such as flip chip, TCB equipment and packaging material

Provide plan and resource requirement to enable new technology

Set up DOE plan and execute

Build sample and perform data analysis skill

Lead efficiency trouble shooting skill to improve process

Prepare documentation for process transfer from TD to HVM

Review process stability by FDC, SPC and test result

Requirement

Strong technical problem-solving and data analysis skill

Open mindset to introduce new technology and process development

Above 3 years experience on Assembly process

Fluent in English communication

Excellent communication skill

Bachelor or Master degree in engineering as material science, mechanical, chemical engineering or physics and chemistry

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.