Kforce's client, a growing engineering technology company in the Chandler, AZ area is seeking a Senior Electronics Packaging Engineer/Project Manager (Flip Chip). We are working directly with the hiring authority. This company offers a competitive base salary and annual bonus. Candidates must reside in the Phoenix, AZ metro area and/or be able to relocate to the Phoenix, AZ area. Our client will provide a relocation package. This position is hybrid remote. (2 days from home and 3 days in office). Responsibilities: * Partner with teams to achieve annual goals, while managing customer relationships to grow market share * Provide program management and internal process development in support of customers, offshore factories and supplier development teams while supporting qualification and mass production of flip chip products * Promote company technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers * Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions; To include: substrate design, silicon to package interconnects, product assembly material selections, etc. * Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans * Work closely with customer package engineering and Company factory engineering to understand/characterize prototype build plans; Enabling successful qualifications and on-time manufacturing production ramps * Assist the team in designing experiments, analyzing factory build data, root cause failure analysis investigation, and corrective action pathways to resolution