Join a team recognized for leadership, innovation, and diversity
Join a team that designs, fabricates, assembles and test high reliability integrated circuits and sensors for Honeywell Aerospace. You will be primarily responsible for supporting manufacturing operations in the Integrated Circuit Assembly area. Priorities include evaluating new and currently existing products using metrology equipment to influence the planning and designing of manufacturing engineering processes pertaining to semiconductor device fabrication. You will be part of an integrated production team, responsible for achieving manufacturing goals.
You will work closely with world class hardware and design engineers during the planning, design, test, and integration phases of IC product development. You will perform multiple engineering activities to ensure the production of quality and cost-effective material, emphasizing continuous improvement activities.
Key Responsibilities
•\tWork with cross functional team to assemble IC sensors in a cleanroom environment.
•\tResponsible for wire bond processing, solder melt, solder reflow and seam weld sealing processes for Semiconductor product line.
•\tAssist design engineering in the development, process refinement, problem resolution, and yield enhancement activities during new \tproduct development phase of product life cycle.
•\tPerform database management functions for product line.
•\tManage work priorities and commitments to maximize benefit to multiple manufacturing and developmental organizations.
Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen. Dual Citizenship is not allowed due to contractual requirements
“The annual base salary range for this position is\n. Please note that this salary information serves as a\ngeneral guideline. Honeywell considers various factors when extending an offer,\nincluding but not limited to the scope and responsibilities of the position,\nthe candidate's work experience, education and training, key skills, as well as\nmarket and business considerations.”
YOU MUST HAVE
Bachelor’s Degree in related field
•US Citizenship due to contractual requirements
•Dual Citizenship is not allowed due to contractual requirements
•Previously held USG Secret clearance, or no known barriers to achieve a USG Secret security clearance
•Ability and willingness to work on-site at Honeywell Aerospace
WE VALUE
WE VALUE
• 3-5 Year Experience in a Semi-Conductor Manufacturing role
•\tPrevious experience with IC Assembly processing or other sensor assembly processing
•\tKnowledge of Mil Specifications and QML quality standards
•\tPrior experience with wire bonding, solder sealing, and vacuum sealing on sensor products
•\tExperience with flip chip or column attach of semiconductor devices
•\tPrevious experience with plastic packaging of electronic sensors
•\tDatabase management experience
•\tPrior experience with yield analysis techniques and evaluation
•\tAbility to interact with other technical personnel
U.S. PERSON REQUIREMENTS
Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen. Dual Citizenship is not allowed due to contractual requirements
Additional InformationJOB ID: HRD242602Category: Integrated Supply ChainLocation: 12001 State Highway 55,Plymouth,Minnesota,55441,United StatesExemptDue to US export control laws, must be a US citizen, permanent resident or have protected status.Engineering (GLOBAL)
Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.