Micross Advanced Interconnect Technology is seeking a knowledgeable, self-motivated physical science or engineering student for an internship with our Process Engineering team. The internship will require extensive hands-on wafer processing in our cleanroom facilities with the successful candidate performing any of the following: wet processing, thin film depositions (sputter, e-beam, and/or PECVD), dry etching, and electroplating. The successful candidate should have some knowledge of wafer processes and basic device processing steps. Experience with material characterization, metrology measurements, data recording, and data presentation/summation is a plus. This is a spring internship that can be extended into the summer. 25 hours a week maximum. Other Duties & Responsibilities: + Comply with all safety policies, practices and procedures. + Comply with all quality and ITAR policies, practices and procedures; + Participate in proactive team efforts to achieve departmental and company goals; + Contribute to building a positive team spirit; + Communicate effectively with all levels of employees; + Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties. + Perform other related duties as assigned Requirements + Rising senior in a B.S physical science or engineering program or B.S. working toward an advanced degree. + Excellent hands-on laboratory skills + Excellent written and verbal communication skills + PC proficiency is a must + Working knowledge of Word, EXCEL, and PowerPoint + Cleanroom experience is a plus + Wafer processing experience is a plus Due to Micross AIT’s business and ITAR-registration status, successful candidates must be US citizens or US permanent resident. Benefits If you are interested in gaining valuable semiconductor processing experience, working in a dynamic, back-end-of-line wafer processing facility focused on advanced packaging and interconnect technologies, please apply.